Knowledge & Support

MIP (Micro IC Package) technology is an advanced LED packaging method that plays a crucial role in the development of fine-pitch and high-performance LED displays. Unlike traditional packaging methods like SMD or COB, MIP integrates the LED chip and IC driver into a single, ultra-compact structure, allowing for greater pixel density, improved heat dissipation, and enhanced reliability.

Key Features of MIP Technology

--Ultra Fine Pitch Capability
MIP enables pixel pitches as small as P0.4 to P1.2, making it ideal for COB Micro LED TVs, control rooms, and conference LED displays.

--Integrated IC Architecture
The micro IC design simplifies internal circuitry, leading to faster signal response, less power loss, and lower heat generation.

--High Contrast & Color Uniformity
MIP displays deliver deep blacks, better grayscale performance, and more uniform colors—ideal for indoor applications requiring premium image quality.

--Improved Reliability
Compared to SMD LEDS, MIP offers better resistance to static electricity, fewer soldering points, and longer lifespan.

Why MIP Matters for Next-Gen LED Displays

With the rising demand for Mini LED, 4-in-1 LED, and All-in-One COB LED displays for conferences, MIP technology addresses the challenges of:

--Pixel miniaturization

--Power efficiency

--Panel stability

--Seamless surface integration

It also supports low power consumption LED screens, which are increasingly important for green energy LED billboard solutions and energy-saving indoor LED displays.

Conclusion

MIP is a next-generation packaging innovation that makes LED displays sharper, smarter, and more stable. Whether you're building a COB Micro LED video wall, a conference room display, or a premium rental LED screen, MIP brings long-term advantages in performance and energy efficiency.

At BRIGHTEN LED, we offer custom MIP-based LED solutions tailored for fine pitch, high brightness, and low power consumption display needs.

Contact us now！